CPU-190-01

COM-HPC™ Server CPU Board
Equipped with Intel® Xeon® D-1700 processor

Intel Xeon D
CPU-190-01

Features

  • Intel® Xeon® D-1700 processor
  • DDR4 DIMM: 4 sockets (Up to 256GB) ECC/nonECC
  • COM-HPC™ Server Module
  • PCI Express®: 35 lanes
  • NBASE-T (2.5G): 1 port
  • 10GBASE-KR: 5 ports
  • Size D (160 x 160mm)
  • Linux、Windows® 10 IoT Enterprise

Description

with the Intel® Xeon® D-1700 processor. Combining the COM-HPC™ standard, which supports more powerful CPUs and high-speed communication interfaces, with the Intel® Xeon® D-1700 processor, this product is suitable for AI systems that require high performance and edge computing in 5G high-speed communication networks.

 

This product can be used in combination with a carrier board equipped with connectors, PHYs, etc. that match the customer’s application. Since the core part of the computer has been designed and verified as a CPU module, it is possible to reduce the cost and time required to develop equipment to suit the application.

 

We also provide professional services such as BIOS customization, carrier board development, and system design including chassis and FW. We can also provide consultation on custom products based on this board.

Edge Server

Specifications

ProcessorIntel® Xeon® D-1700 processor
MemoryDDR4 UDIMM/RDIMM x4 (up to 256 GB, ECC/nonECC)
StorageEmbedded1x SPI-Flash (BIOS) – 1x EEPROM
I/O InterfacesEthernet5x 10GBASE-KR, 1x NBASE-T (2.5G)
PCI Express35 lanes
SATA2 ports
USB2x USB 3.2 Gen 1, 4x USB 2.0
Serial2 ports
SPIYes
eSPI1 port
SMBus1 port
I2C1 port
GPIO12
RTCYes
WatchdogYes
TPMTPM 2.0
SensorsTemperature, voltage
PowerInputTBD
ConsumptionTBD
EnvironmentOperating temperatureTBD
Storage temperatureTBD
HumidityTBD (no condensation)
CertificationsEnvironmentalRoHS (2011/65/EU,(EU)2015/863)
MechanicalDimensionsSize D (160 x 160mm)
SoftwareOSLinux, Windows 10® IoT Enterprise

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CPU-190-01

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