with the Intel® Xeon® D-1700 processor. Combining the COM-HPC™ standard, which supports more powerful CPUs and high-speed communication interfaces, with the Intel® Xeon® D-1700 processor, this product is suitable for AI systems that require high performance and edge computing in 5G high-speed communication networks.
This product can be used in combination with a carrier board equipped with connectors, PHYs, etc. that match the customer’s application. Since the core part of the computer has been designed and verified as a CPU module, it is possible to reduce the cost and time required to develop equipment to suit the application.
We also provide professional services such as BIOS customization, carrier board development, and system design including chassis and FW. We can also provide consultation on custom products based on this board.
|Processor||Intel® Xeon® D-1700 processor|
|Memory||DDR4 UDIMM/RDIMM x4 (up to 256 GB, ECC/nonECC)|
|Storage||Embedded||1x SPI-Flash (BIOS) – 1x EEPROM|
|I/O Interfaces||Ethernet||5x 10GBASE-KR, 1x NBASE-T (2.5G)|
|PCI Express||35 lanes|
|USB||2x USB 3.2 Gen 1, 4x USB 2.0|
|Humidity||TBD (no condensation)|
|Mechanical||Dimensions||Size D (160 x 160mm)|
|Software||OS||Linux, Windows 10® IoT Enterprise|