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| Features |
HighPerformance and Low Power – With the Adbc8034 it is possible to match power and performance: a rich selection of dual and quad core CPUs based on the 2nd Generation Intel® Core™ architecture always delivers the right configuration.
Large Memory – Supporting up to 8GB of DDR3-1333 SDRAM, the Adbc8034 suits even the most memory hungry applications.
High Reliability – The Adbc8034 has direct-mounted SDRAM memory and CPU, ensuring extremely stable operation; moreover, ECC support adds further reliability.
Feature Rich – The Adbc8034 delivers a broad range of peripherals, including SATA, USB, Gigabit Ethernet, Video, PCI and PCI Express.
Third Video Port – The Adbc8034 employs a modified Type 2 COM Express interface where the EIDE port has been replaced by a third video port supporting SDVO.
Compact design – COM Express Basic Module size(125mm x 95mm).
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The Adbc8034 is a COM Express module that delivers incredible performance and power efficiency: it supports dual and quad core 2nd Generation Intel® Core™ CPUs, providing the right power/performance profile for any application.
Designed for maximum reliability, the Adbc8034 supports up to 8GB ECC memory, with memory and CPU soldered directly on the board to provide superior resilience to mechanical stress and vibrations.
With a Basic Module form factor, the Adbc8034 packs a large number of peripherals in a very compact design: Gigabit Ethernet, four SATA, eight USB, three video ports, x16, x4 and two x1 PCI Express and PCI.
The Adbc8034 simplifies programming and development with support for Window® 7, Windows® Embedded Standard 7 and Wind River Linux. |
| Specifications Different variations of CPU frequency and memory size are available. |
| Processor |
Intel® Core™ i7-2715QE / 2.1GHz, 45W |
| Intel® Core™ i7-2655LE / 2.2GHz, 25W |
| Intel® Core™ i7-2610UE / 1.5GHz, 17W |
| Intel® Core™ i5-2515E / 2.5GHz, 35W |
| Chipset: Mobile Intel® QM67 |
| Memory |
Direct-mounted DDR3-1333 SDRAM up to 8GB, ECC supported
Factory option configurations: 1GB/2GB/4GB/8GB
Dual channel (1GB supports single channel only)
Boot ROM: SPI-FLASH 8MB |
| COM Express |
PICMG COM.0 COM Express Module Base Specification Rev 1.0 |
| Basic Module size (125mm x 95mm) |
| Type 2 Pin layout (SDVO replaces PATA) |
| System I/O |
PCI Express 2.0: X16 1 port (X8 2 ports available as factory option),
X4 1 port (X1 4 ports available as factory option), X1 2 ports |
| Graphics: Analog VGA / SDVO / LVDS 1 port each |
| 2x SATA-600 + 2x SATA-300 |
| 8x USB 2.0 |
| 1x Ethernet 10/100/1000BASE-T |
| 1x PCI(32bit, 33MHz, 3.3V) |
| 1x LPC |
| 1x SMBus |
| 1x I2C Bus |
| 4x GPI + 4x GPO |
| Power |
Supply voltage:
DC 12V (VCC_12V) 12.0V, ±5%, max 13.4A
DC 5V (VCC_5VSBY) 5.0V, ±5%, max 0.8A
DC 3V (VCC_RTC) 3.0V, max 6uA |
| Mechanical |
125mm (W) x 95mm (L) x 21mm (H)
(incl.8mm height for heat spreader and spacers)
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| Heat sink is optionally available |
| Weight: 285g |
| Environmental |
Operating Temperature: 0ºC to +60ºC |
| Storage Temperature: -10ºC to +70ºC |
| Humidity: up to 80%RH (no condensation) |
| RoHS compliant |
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